Quantum Hex-Logic Buffing Pads are designed for improved polishing performance through innovative features. These pads utilize a new foam composition that efficiently transfers power to the paint while minimizing heat buildup and user fatigue. They are compatible with dual action and rotary polishers. The pad design incorporates Hex-Logic grooves for maximized coverage and improved airflow during polishing. A redesigned hook and loop attachment enhances durability and heat dissipation. The cutting face of the pad is tapered to minimize wear and tear. Improved manufacturing techniques ensure a longer lifespan for the pads. To further extend pad life and reduce heat, Quantum engineers incorporated a vented center hole that reduces stress on the pad and channels heat away. Quantum Hex-Logic Pads are available in a variety of colors to correspond to different polishing stages.
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